Committed to the server/datacenter power industry

High speed and high density electronics have driven demand for significant increases in the amount of power needed for power to board applications. To meet the need for higher current density interconnect Amphenol Industrial Operations developed the RADSOK® Power to Board series of connectors. RADSOK® Power to Board solutions facilitate the distribution of power with higher amperage, while allowing the design engineer to achieve size and weight reductions.

Conventional interconnects are limited in their ability to deliver high current with out consuming excessive board surface area. The RADSOK® Power to Board series of connectors incorporates a hyperbolic lamella socket contact construction that provides more contact surface area. The high performance contact enables higher current carrying capabilities with lower temperature rises than traditional contact systems.

Amphenol RADSOK® Power to Board product line offers many options for delivering high current, single-point connections to the PCB. Please contact your Amphenol Industrial representative for product extensions and custom applications.